RESEARCH & INTELLIGENCE
Know the source.
Keep the context.
A dated research snapshot reviewed on 10 November 2026. Company announcements describe their own activities; our analysis is identified separately.
HISTORICAL MARKET DATA / 2025
US$795.6 billion in annual sales.
WSTS reported final 2025 global semiconductor sales of US$795.6 billion, up 26.2% year on year, in its 6 March 2026 release. This incorporates finalized fourth-quarter data.
An earlier SIA release dated 6 February 2026 reported US$791.7 billion. We use the later finalized WSTS figure. Publication dates matter when comparing market summaries.
Scope: worldwide semiconductor product sales. These totals do not measure foundry capacity, equipment revenue, investment spending or the value of this domain. No 2026 forecast is presented as a realized result.
WSTS final results, 6 March 2026 · Earlier SIA release, 6 February 2026
COMPANY ANNOUNCEMENT / 12 OCTOBER 2026
Innovation across organizational boundaries.
Applied Materials announced the unveiling of its EPIC Center, a facility for collaborative semiconductor equipment and process technology R&D.
Our interpretation: An industry information platform is more useful when it connects materials, equipment and manufacturing decisions. This is an editorial conclusion, not a claim that this site participates in EPIC.
Original announcement
TECHNOLOGY CONTEXT / 2025 ANNUAL REPORTS & LIVE PAGES
Follow the connections, not a single metric.
TSMC describes design enablement and packaging within its Open Innovation Platform. ASML describes a holistic lithography approach connecting systems, computational modeling and measurement.
Our interpretation: Readiness depends on compatible tools, processes and interfaces. A single yield assumption in the planner is an illustration; actual results depend on the product, process and qualification evidence.
TSMC OIP · ASML products · ASML process explanation
Source register
Accessed 10 November 2026. Undated pages are labeled, rather than assigned an invented publication date.
S1 / 6 March 20262025 sales of US$795.6bn, up 26.2%; final fourth-quarter data. Historical, not a 2026 sales estimate.
S2 / 6 February 2026Earlier total US$791.7bn. Retained to explain differing publication vintages; not used as the final total.
S3 / 12 October 2026Announces collaborative equipment and process R&D facility; identifies Gary Dickerson as President and CEO and C.C. Wei as TSMC Chairman and CEO.
S4 / Undated live pageCollaborative innovation and commercialization positioning. Website language may change.
S5 / Undated live pageMaterials engineering, process capabilities, advanced logic, memory and heterogeneous integration.
S6 / Undated live pageDesign enablement, EDA, IP, design services and advanced packaging ecosystem.
S7 / 2025 reporting period; published 2026Advanced processes, specialty technologies, packaging and geographic manufacturing plans. Plans are not completed capacity.
S8 / Undated live pageLithography, computational modeling, metrology and inspection.
S9 / 2025 reporting period; published 2026Christophe Fouquet is President and CEO; discussion of EUV, advanced packaging and customer and supplier relationships.
S10 / 2025 reporting period; published 2026Process explanation: deposition, resist, lithography, development, etch, implantation and resist removal.
Research refresh is editorial and manual. This website does not provide a live news feed, investment advice, supplier certification or guaranteed availability.